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TEST BOARD
Test Load Board Design
Schematic Design Tool: Or-Cad, Cadance Allegro concept HDL Design Tool: Allegro (PCB Editor, APD) Creates net-list in the design file after completing load BD design and schematic ECO (back-annotation) Detects a design error after comparing the created net list to the schematic’s Ch list
SoC Design
Schematic Tool: Or-Cad, Cadance Allegro concept HDL Design Tool: Allegro Layout Library Standardization (LMS Development), Part Matching System EMI / EMC Consulting, PI/SI Simulation Application of High Speed and Impedance Matching Rule Build-Up (0.35Pitch) Design and Fabrication
BURN-IN BOARD
MBT(Monitoring Burn-in Tester)
Burn-in Board
Specifications
Product Category : SDRAM, DDR series, SRAM, GDDR6, RDRAM(DA), NOR/NAND-Flash, MCP
Application System : ANDO8652 Series, DM1400 Series (Test speed Max 20MHz)
Pitch: Min. 0.3 Pitch (Through Hole) – Able to Cover All Pitches
Density : Max. 480
PCB Size : 450x570mm
PCB Layer : Max 8L
Normal Burn-In BoardSpecifications
Product Category : SDRAM, DDR series, SRAM, GDDR6, RDRAM(DA), NOR/NAND-Flash, MCP
Application System : ANDO8652 Series, DM1400 Series (Test speed Max 20MHz)
Pitch: Min. 0.3 Pitch (Through Hole) – Able to Cover All Pitches
Density : Max. 480
PCB Size : 450x570mm
PCB Layer : Max 8L
THB Test
(Temperature Humidity Bias)
Specifications
Operating condition : 85℃/85%
Target Device : DRAM / SRAM / FLASH / MCP / CIS / DDI / ASIC / PMIC
Type : Socket Direct & Dut board
Pitch: Min. 0.3mm - Able to Cover All Pitches
THB Test (Temperature Humidity Bias)Specifications
Operating condition : 85℃/85%
Target Device : DRAM / SRAM / FLASH / MCP / CIS / DDI / ASIC / PMIC
Type : Socket Direct & Dut board
Pitch: Min. 0.3mm - Able to Cover All Pitches
MFT(Multi Flexibility Tester)
Burn-in Board
Specifications
Product Category : Flash(NAND, toggle NAND etc.), eMCP
Application System : DM1900 Series (Test speed 100MHz (200Mbps))
Pitch: Min. 0.3 Pitch (Through Hole) - Able to Cover All Pitches
PCB Size : 450x555mm
PCB Layer: Max 18L
High-Speed Burn in BoardSpecifications
Product Category : Flash(NAND, toggle NAND etc.), eMCP
Application System : DM1900 Series (Test speed 100MHz (200Mbps))
Pitch: Min. 0.3 Pitch (Through Hole) - Able to Cover All Pitches
PCB Size : 450x555mm
PCB Layer: Max 18L
HAST
(High Accelerated Temperature Humidity Test)
Specifications
Operating Condition : 125℃ / 85% / 3G
Target Device : DRAM / SRAM / FLASH / MCP / CIS / DDI / ASIC / PMIC
Type : Socket Direct & Dut board
Pitch: Min. 0.3mm - Able to Cover All Pitches
HAST (High Accelerated Temperature Humidity Test)Specifications
Operating Condition : 125℃ / 85% / 3G
Target Device : DRAM / SRAM / FLASH / MCP / CIS / DDI / ASIC / PMIC
Type : Socket Direct & Dut board
Pitch: Min. 0.3mm - Able to Cover All Pitches
Burn-in Board Design
Schematic Tool : Cadstar Schematic, Or-Cad, Cadance concept HDL Design Tool : Allegro Layout, Power PCB, Cadstar
Product
Normal Burn-In Board
High Speed Burn-In Board
THB (Temperature Humidity Bias) Test
HAST (High Accelerated Temperature Humidity Test)