Come and experience the total solution of TFE.


Features and benefits

  Supports the fabrication of change kit, socket and board for clients’ diverse facilities in Korea and abroad

  Able to design products in diverse parallels of Handlers

  Provides a test solution (item) which keeps maximizing handler efficiency and improving yield

  Provides a solution (item) which maximizes test efficiency and improves yield

Fast design and processing of new products

  Able to support total solution according to the integrated fabrication/development of change kit, test socket and Hi-Fix Board

  ESD protect

  Applies the design which improves alignment for fine pitch (0.5P 0.4P, 0.3P, 0.2P) items

  Improves alignment in the fine pitch align guide films (0.5P 0.4P, 0.3P, 0.2P)

  Increases test prime yield

  Reduces DVC loss rates by preventing package loss

Line-up Parts for Change Kit

  Memory Handler Change Kit

  Parallels : 32/64/128/256/1024

  Test Tray Plate With Device Insert Carrier

  Match Plate With Pusher Assembly

  Load/Unload Buffer Plate, etc.