BUSINESS AREA
Come and experience the total solution of TFE.
MEMORY
CHANGE KIT / SOCKET / BOARD
Features and benefits
Supports the fabrication of change kit, socket and board for clients’ diverse facilities in Korea and abroad
Able to design products in diverse parallels of Handlers
Provides a test solution (item) which keeps maximizing handler efficiency and improving yield
Provides a solution (item) which maximizes test efficiency and improves yield
Fast design and processing of new products
Able to support total solution according to the integrated fabrication/development of change kit, test socket and Hi-Fix Board
ESD protect
Applies the design which improves alignment for fine pitch (0.5P 0.4P, 0.3P, 0.2P) items
Improves alignment in the fine pitch align guide films (0.5P 0.4P, 0.3P, 0.2P)
Increases test prime yield
Reduces DVC loss rates by preventing package loss
Line-up Parts for Change Kit
Memory Handler Change Kit
Parallels : 32/64/128/256/1024
Test Tray Plate With Device Insert Carrier
Match Plate With Pusher Assembly
Load/Unload Buffer Plate, etc.